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Ingénieur de Recherche - Physico-Chimie des Membranes Polymères

ABG-128230 Job Confirmed
2025-01-30 Permanent > €45,000 and < €55,000 annual gross
Logo de
NELUMBO DIGITAL SAS
- Auvergne-Rhône-Alpes - France
Materials science
  • Process engineering
  • Engineering sciences
Start-up - Polymer - Membrane - Adhesion - Microelectronics - Wafers
Research and Development

Employer

Nelumbo specializes in addressing critical bottlenecks of the semiconductor industry through temporary bonding innovations. Our aim is to offer novel and sustainable solutions from our labs towards large scale semiconductor applications. A notable achievement is the successful application of polymer membranes in facilitating wafer-to-chip transformation, responding to a crucial industrial need. We bring to market a viable and essential solution for wafer bonding and debonding for chip fabrication. This temporary bonding will also enable another key application with semiconductor strain engineering to tune electronic and optical properties.

Position and assignments

Nelumbo is currently seeking a Research Scientist/Engineer specialized in polymer science, highly motivated to play a central role in our company. The successful candidate will lead and support research and development for our polymer membrane processes with conceptualization, characterization, and optimization of temporary adhesives for microelectronic wafer applications.

Geographic mobility:

International

Telework

Part time

Starting date

2025-03-03

Profile

Temporary Wafer Bonding: Wafer-to-chip transformation

The position entails active involvement in the theoretical and experimental aspects of polymer science. The process involves the use of the polymers from wafer bonding to chip fabrication. The work will be focused on solution preparation, coating techniques and bonding and debonding procedures. The applicant will use advanced characterization methodologies available at the Nano Characterisation Platform of the IRIG Institute (PFNC-CEA) to optimize the final process. The primary aim is to enhance temporary wafer bonding, as it provides mechanical support and stability to extremely thin semiconductor wafers during processing steps.

Temporary Wafer Bonding: Semiconductor membrane straining

These polymer membranes will be further utilized to modify the optical and electronic properties of semiconductor materials through mechanical deformation. This innovative approach introduces critical enhancement of the physical properties of semiconductors and perovskite structures at unprecedented precision and levels. The published work shows significant potential across various applications, including microLED displays, MOSFETs, and quantum bits. This breakthrough in materials performance opens a myriad of new optoelectronic devices.

Candidate role and responsibilities

The ideal candidate will have a strong scientific background in polymer science and engineering, with expertise in translating complex physics and chemistry concepts into innovative solutions for polymer behaviors during wafer processing. Key responsibilities include developing and optimizing polymer membrane for bonding and debonding functionalities for wafer processing, as well as investigating polymer material properties such as: adhesion strength, thermal stability, mechanical strength, and chemical resistance to meet customer requirements. Particular focus will be given to the microstructure characterization, studying permeability and diffusion mechanisms in polymers, including migration, swelling, and interface behavior.

Additionally, our technology should enable wafer recycling by minimizing residue generation during wafer debonding, providing a more sustainable and eco-friendly solution for the industry.

The role involves hands-on experimentation with polymer solution preparation, coating, bonding and debonding processes, and advanced characterization techniques, ideally extending to polymer synthesis. A myriad of tools available at the PFNC — including scanning electron microscopy (SEM), X-ray diffraction imaging, ellipsometry, optical reflectometry, thermomechanical analysis, and photoluminescence — will support in-depth analysis of these systems. Data analysis will play a crucial role in driving insights to improve membrane performance under various processing conditThe ideal candidate will have a strong scientific background in polymer science and engineering, with expertise in translating complex physics and chemistry concepts into innovative solutions for polymer behaviors during wafer processing. Key responsibilities include developing and optimizing polymer membrane for bonding and debonding functionalities for wafer processing, as well as investigating polymer material properties such as: adhesion strength, thermal stability, mechanical strength, and chemical resistance to meet customer requirements. Particular focusions. Additionally, the Research Engineer will stay up-to-date with the latest advancements in polymer science and wafer processing technologies to identify innovative solutions and maintain a competitive edge.

Additional responsibilities include preparing technical reports and presentations to communicate research findings effectively, and participating in shows and conferences in the field of expertise to disseminate the capabilities of our techniques to the technical and scientific community.

Goals

 ● Develop and optimize polymer membranes tailored for bonding and debonding systems used in wafer processing.

 ● Investigate polymer material properties, including adhesion, thermal stability, permeability, and mechanical strength, to meet the specific demands of wafer handling.

 ● Perform hands-on experimentation, including polymer solution making, coating processes, and advanced characterization techniques. This can be even extended to polymer synthesis when possible.

 ● Work with the PFNC to use characterization instruments such as SEM, photoluminescence, optical reflectometry, ellipsometry, etc.

 ● Work at the European Synchrotron for X-ray diffraction imaging.

 ● Analyze data to provide insights for improving membrane performance under various processing conditions, such as grinding, dicing, and steam debonding.

 ● Stay up-to-date with the latest advancements in polymer science and wafer processing technologies to identify innovative solutions and maintain a competitive edge.

● Propose novel ways of using the polymers to fix the strain in semiconductor materials.

 ● Prepare technical reports and presentations to communicate research findings effectively.

 ● Participate in exhibitions and conferences in the field of expertise to disseminate to the technical and scientific community the capabilities of our techniques.

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